3D and Cost of Ownership

3D Cost of Ownership (CoO)
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EMC-3D
	EMC-3D Consortium Overview
	Consortium for 3D TSV Interconnect
Semitool
	Cost-Effective TSV Chip Integration - Paul Siblerud
	Copper and Lead-Free Electrodepositon for Advanced Packaging Applications - Rozalia Beica "Emerging Requirements for Wafer-Level Packaging Metrology" Webcast
Texas A&M University
	Challenges in Process and Manufacturing - Dr. Manual Soriage (Texas A&M), Dr. Christo Bojkov (MAXIM-DallasSemi)