Contact Information
EMC3D international Semiconductor 3-D Equipment and Materials consortium was created to develop and market a cost-effective, manufacturable, stackable through-silicon-via (TSV) interconnection technology for chip integration and MEMS/sensors packaging using consortium-recommended equipment and process flows that are based on plated metal electrodes and thinned wafers. For more information about this consortium, contact:
Paul Siblerud (USA)
VP Marketing , Semitool, Inc.
Program Director of EMC-3D Consortium
PH: 406-752-2107 ext. 7509
Cell: 406-250-9064
Fax: 406-752-5522
E-mail: psiblerud@emc3D.org
