System integration and the packaging of electronic products are increasingly turning into a determining factor of economic success for suppliers and users from the consumer electronics, telecommunications, mechanical engineering and automotive sectors. Maintaining your competitive edge in these areas means keeping on top of technological developments.

We at the Fraunhofer Institute for Reliability and Microintegration IZM want to help make the difference. Together with the Research Center for Microperipheric Technologies at the TU Berlin the Fraunhofer IZM represents an efficient research, development and service potential, especially in the areas of: System Integration Technologies Wafer Processing & MEMS Technologies Materials and Reliability Design and Sustainable System Development Our main objective is to support firms in the broad application of microelectronic and microsystem technologies.