| December 21, 2009 |
Applied Materials Completes Acquisition of Semitool More... |
| October 15, 2009 |
ITRI and Applied Materials Collaborate to Advance 3D IC Technology More... |
| July 14, 2009 |
EMC3D extends the consortium life two additional years and expands goals for 300mm Thru-Silicon-Via interconnect. More... |
| April 6, 2009 |
Wanxiang America Corp acquires Isonics Semiconductor Group; joins EMC3D. More... |
| February 24, 2009 |
Applied Materials joins EMC3D International TSV consortium. Consortium works toward goal of sub-$150 CoO using integrated Cu-TSV process flow. More... |
| September 4, 2008 |
EMC-3D consortium develops process and cost model for interconnect Thru-Silicon-Via (iTSV™) structures - Members announce sub $190 CoO is achievable today with integrated 5-micron by 30-micron via-first chip stacking technology. More... |
| April 8, 2008 |
Datacon Technology joins EMC-3D consortium to develop cost-effective 3D Thru-Silicon-Via interconnects. More... |
| November 13, 2007 |
Dr. Fred Roozeboom of NXP joins EMC3D consortium as Technical Advisor. More... |
| November 1, 2007 |
TSV 3-D Packaging on Track for 2008 (Markus Wimplinger, Director of Business Unit Technology Development and IP, EV Group, St. Florian, Austria, www.evgroup.com -- Semiconductor International, 11/1/2007) |
| May 3, 2007 |
Brewer Science, Inc. joins the international consortium EMC-3D, dedicated to providing cost-effective integrated Thru-Silicon-Via (TSV) technology for chip stacking applications. More... |
| February 2007 |
"EMC-3D Introduction and Overview at Semiconductor International (Issue Feb. 2007) More... |
| February 1, 2007 |
CEA-Leti joins EMC-3D Consortium |
