NEWS...
| April 8, 2008 | Datacon Technology joins EMC-3D consortium to develop cost-effective 3D Thru-Silicon-Via interconnects. More... |
| November 13, 2007 | Dr. Fred Roozeboom of NXP joins EMC3D consortium as Technical Advisor. More... |
| November 1, 2007 | TSV 3-D Packaging on Track for 2008 (Markus Wimplinger, Director of Business Unit Technology Development and IP, EV Group, St. Florian, Austria, www.evgroup.com -- Semiconductor International, 11/1/2007) |
| May 3, 2007 | Brewer Science, Inc. joins the international consortium EMC-3D, dedicated to providing cost-effective integrated Thru-Silicon-Via (TSV) technology for chip stacking applications. More... |
| February 2007 | "EMC-3D Introduction and Overview at Semiconductor International (Issue Feb. 2007) More... |
| February 1, 2007 | CEA-Leti joins EMC-3D Consortium |
