Members' Processes

Equipment

Semitool: Plating, Thinning (wet-etch based)

Alcatel: Via Etch, Dicing (dry-etch based)

XSiL: Via Drill, dicing (laser-drill based)

EVG: Stacking, Alignment, Resist process

Isonics: Wafer grinding service

Materials

Rohm and Haas PFT: Plating chemicals

AZ: Photoresists

Enthone: Plating chemicals

Brewer Science: Specialty materials

R&D Partners

SAIT (Samsung Institute of Technology): Sensors/MEMS/Chip stacking

Fraunhofer IZM: Sensors/MEMS/Chip Stacking

KAIST (Korea Advanced Institute of Science and Technology): Chip stacking

TAMU (Texas A&M University): Electrochemical Studies

CEA-Leti: Sensors/MEMS/Chip Stacking

NXP: Sensors/MEMS/Chip Stacking