| Santa Clara, California, December 21, 2009 - Applied Materials Completes Acquisition of Semitool |
| Taipei, Taiwan, October 15, 2009 - ITRI and Applied Materials Collaborate to Advance 3D IC Technology |
| Kalispell, Montana, July 14, 2009 - EMC3D extends the consortium life two additional years and expands goals for 300mm Thru-Silicon-Via interconnect. |
| More news.... |
EMC3D integration solution sees clear path to sub $150/wafer TSV
The international equipment, materials and technology consortium is successfully integrating both iTSV or via-first and pTSV or via-last with aspect ratios up to 10:1. The consortium partners are currently balancing equipment for a production via-first iTSV line that will offer an overall CoO of under $112€/wafer. |
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