| In The News ... |
| San Jose California, April 6, 2009 - Wanxiang America Corp acquires Isonics Semiconductor Group; joins EMC3D. |
| Santa Clara California, February 24,2009 - Applied Materials joins EMC3D International TSV consortium. Consortium works toward goal of sub-$150 CoO using integrated Cu-TSV process flow. |
| Santa Clara California, September 4, 2008 - EMC-3D consortium develops process and cost model for interconnect Thru-Silicon-Via (iTSV™) structures - Members announce sub $190 CoO is achievable today with integrated 5-micron by 30-micron via-first chip stacking technology. |
| More news.... |
| ANNOUNCEMENTS... |
EMC3D integration solution sees clear path to sub $150/wafer TSV |
| Upcoming Events ... | ||
| May 26-29, 2009 | ECTC 2009 | San Diego, California |
| June 1-3, 2009 | IITC 2009 | Hokkaido, Japan |
| June 3-4, 2009 | EMC3D & IITC | Japan |
| June 15-19, 2009 | EMPC09 (European Microelectronics and Packaging Conference) | Rimini, Italy |
