Datacon was founded in 1986 and since the beginning of 2005 has been part of the Dutch Besi group (BE Semiconductor Industries N.V.), an international group of companies operating in the semiconductor industry. Datacon's main area of expertise is the development and production of high-precision assembly equipment for the microchip industry. Leading microelectronics companies worldwide such as Bosch, Fairchild, Siemens, Philips, Infineon, ST Micro, Skyworks as well as Asian subcontractors like Amkor, ASE and STATSChipPAC are among Datacon's customers.

Using a highly adaptable platform concept with modular systems, Datacon's product range offers a large degree of flexibility and modularity for the IC manufacturing industry. Datacon is one of the leading and most innovative providers of assembly equipment for the semiconductor industry and is ahead of the field when it comes to new technologies such as flip chip and RFID (non-contact data transmission). Offering dynamic, flexible concept strategies and latest technologies, Datacon is known in the die bonder market as a solution supplier and an essential research partner for the semiconductor industry worldwide.

Applications:

Die-to-Wafer pick and place, Die Bonding