In The News ...
Radfeld, Austria, 8 April 2008 - Datacon Technology joins EMC-3D consortium to develop cost-effective 3D Thru-Silicon-Via interconnects.

Eindhoven, 13 November 2007 - Dr. Fred Roozeboom of NXP joins EMC3D consortium as Technical Advisor

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ANNOUNCEMENTS...

EMC3D celebrates 1st year of achievements...
October 11, 2006, the international consortium was started with the goal of providing a successful integrated 3D solution. The initial focus was to determine the flow that would account for a majority of device types and would be fastest to market. The individual members have constructed a cost of ownership model for an entire integrated module and a road map to achieve a cost effective 3D solution in just 3 years.

Upcoming Events ...
June 1-4, 2008 IITC - San Francisco, California  
June 2, 2008 EMC Technical Symposium
Shin Yokohama, Japan
 
June 3, 2008 EMC Technical Symposium
Kita-Itami, Japan
 
June 5, 2008 EMC Technical Symposium
Seoul, Korea
 

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