| In The News ... |
| Radfeld, Austria, 8 April 2008 - Datacon Technology joins EMC-3D consortium to develop cost-effective 3D Thru-Silicon-Via interconnects. |
Eindhoven, 13 November 2007 - Dr. Fred Roozeboom of NXP joins EMC3D consortium as Technical Advisor |
| More news.... |
| ANNOUNCEMENTS... |
EMC3D celebrates 1st year of achievements... |
| Upcoming Events ... | June 1-4, 2008 | IITC - San Francisco, California |
| June 2, 2008 | EMC Technical Symposium Shin Yokohama, Japan |
|
| June 3, 2008 | EMC Technical Symposium Kita-Itami, Japan |
|
| June 5, 2008 | EMC Technical Symposium Seoul, Korea |
|








