Mission...

The mission of the international consortium EMC^3D is to rapidly develop a cost-effective and manufacturable TSV (thru-silicon-via) for 3D chip stacking and MEMS integration.

Technology support for the consortium goals is from associate members Fraunhofer IZM, SAIT (Samsung Advanced Institute of Technology), KAIST (Korea Advanced Institute of Science and Technology), TAMU (Texas A&M University), CEA LETI, and NXP. Material members include The Dow Company, Enthone, Brewer Science, and AZ Electronic Materials with wafer service support from WRS Materials. Equipment companies are Applied Materials,  Datacon, EV Group and Semitool.