Xsil is a world-leading provider of innovative laser micro-machining systems for high volume manufacturing in the semiconductor Industry. Our enabling technology provides customers high throughput production capability for cost-effective, chip-free dicing and drilling vias in thin silicon and scribing of low-k materials. Xsil's laser micro-machining system technology is based on our core competencies of optical and laser system design, robotic vision systems, mechanical and electrical design, software design, and material handling.